China Abrasives Industry Hainan Corporation
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Grinding Wheels for LED Substrate
Application
The grinding wheels for LED substrate are mainly used for back thinning of 2”, 4” and 6”LED epitaxial wafers. They can be used steadily on the Japanese, Korean and Taiwanese grinders with high performance.
Workpiece: sapphire epitaxial wafer, SiC substrate epitaxial wafer, Si substrate epitaxial wafer.
Material of workpiece: Synthetic sapphire, SiC ,single crystal silicon.
Grinders: WEC , GALAXY ,SPEEDFAM , NTS , SHUWA , OKAMOTO.
Main Features
Good surface quality with high efficiency
No deep scratch and crash
Long life and low cost